
產(chǎn)品介紹 Product Introduction
超軟導(dǎo)熱墊片具有超低硬度,高壓縮性等特點(diǎn),相對于常規(guī)導(dǎo)熱墊片具有超低的安裝應(yīng)力,可避免安裝應(yīng)力對芯片或者線路板的破壞。適合對于安裝應(yīng)力要求高和公差較大的場合。
Ultra soft thermal pad has the characteristics of ultra-low hardness and high compressibility. Compared with common thermal pad, it has ultra-low installation stress, which can avoid the damage of installation stress to chip or circuit board. It is suitable for occasions with high installation stress requirements and large tolerance.
產(chǎn)品特點(diǎn) Product Features
-高壓縮性,低安裝應(yīng)力 High compressibility, low installation stress
-更低的接觸熱阻 Lower contact thermal resistance
-適應(yīng)更大的公差場合 Adapt to larger tolerance occasions
典型應(yīng)用 Typical Application
-汽車電子 Automotive electronics
-家電 Household electrical appliances
-可穿戴設(shè)備 Wearable devices
-裝配應(yīng)力敏感芯片 Assemble stress sensitive chip
-公差較大環(huán)境 Environment with large tolerance
產(chǎn)品型號 Product Models

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